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  Announcement of Electronic Grade Epoxy Resin Project with an Annual Capacity of 20,000 tons

2024-2-4

On January 25th, the Ecological Environment Bureau of Wuhu City published the pre-approval of the Environmental Impact Assessment Report for annual production of 20,000 tons of electronic new materials project of Anhui Jialan New Materials Co., Ltd.

Project overview
Project name: annual production of 20,000 tons of electronic new materials project
Project nature: new construction
Construction location: chemical industry park of Wuhu economic and technological development zone
Construction company: Anhui Jialan New Materials Co., Ltd
Construction content and scale: The project covers an area of 28,307 square meters, with a total construction area of 17,000 square meters. It includes production workshops, warehouses, comprehensive buildings, power centers, tank areas, and hazardous waste temporary storage facilities and other auxiliary facilities. After completion, the project will produce 20,000 tons of bisphenol A type epoxy resin annually.
Project investment: 360 million yuan
Construction period: October 2023-August 2025

Encapsulation adhesive is a type of electronic adhesive or adhesive used for sealing, encapsulating or encapsulating electronic devices. After being encapsulated with electronic packaging adhesive, electronic devices play a role in waterproofing, moisture-proof, shockproof, dustproof, anti-corrosion, heat dissipation and confidentiality. Therefore, electronic packaging adhesive boasts such characteristics as high and low temperature resistance, high dielectric strength, good insulation, environmental protection and safety. With China′s strong promotion of the layout of technology fields such as electronics, software, and chips, and the rapid development of the domestic electronics industry, the demand for electronic grade epoxy resin in the market continues to expand.

With the increasing call for environmental protection and the continuous improvement of performance requirements for electronic packaging materials in the integrated circuit industry, higher requirements have been put forward for epoxy resin. The epoxy resin used for IC packaging not only requires high purity, but also low stress, heat shock resistance, and low water absorption, which are urgent issues to be solved.

Regarding issues such as high temperature resistance and low water absorption, domestic and foreign research starts from molecular structure design, focusing on blending modification and the synthesis of new epoxy resins. On the one hand, functional groups such as biphenyl, naphthalene, sulfone, and fluorine elements are introduced into the epoxy skeleton to improve the moisture and heat resistance of the cured material; On the other hand, by adding several representative curing agents and studying the curing kinetics, glass transition temperature, thermal decomposition temperature, and water absorption of the cured materials, we aim to prepare high-performance epoxy resin for electronic packaging materials.
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